JPH036862U - - Google Patents
Info
- Publication number
- JPH036862U JPH036862U JP6565889U JP6565889U JPH036862U JP H036862 U JPH036862 U JP H036862U JP 6565889 U JP6565889 U JP 6565889U JP 6565889 U JP6565889 U JP 6565889U JP H036862 U JPH036862 U JP H036862U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- diamond film
- patterning
- synthesis
- dissipation board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565889U JPH036862U (en]) | 1989-06-05 | 1989-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565889U JPH036862U (en]) | 1989-06-05 | 1989-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036862U true JPH036862U (en]) | 1991-01-23 |
Family
ID=31597682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6565889U Pending JPH036862U (en]) | 1989-06-05 | 1989-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036862U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014170834A (ja) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | パワー半導体の放熱構造およびこれを用いたオーディオ装置 |
-
1989
- 1989-06-05 JP JP6565889U patent/JPH036862U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014170834A (ja) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | パワー半導体の放熱構造およびこれを用いたオーディオ装置 |
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